Key Features of 4-2170808-1 Cage Assembly
- Supports QSFP28 / QSFP56 form factor
- Max data rate: 28 Gb/s (per channel or aggregate as specified)
- Operating temperature range: –40 °C to +85 °C (–40 °F to +185 °F)
- Designed for signal/data transmission applications
- Non-sealable design (not sealed against ingress)
- Ganged cage construction
- Includes heat sink (pin style)
- Internal/external EMI springs for EMI containment
- Tin-plated PCB contact termination (through-hole, press-fit style, tail length 2.05 mm)
- Cage material: Nickel silver
- UL flammability rating: UL 94V-0
- Heat sink height: 4.2 mm
- PCB mounting: supports typical 1.57 mm (0.062 in) thick boards
- Lightpipe included
- Packaged in box & tray format
4-2170808-1 1X2 QSFP28 Cage Specifications
| Parameter |
Specification |
| Product Type |
Cage Assembly (Pluggable I/O) |
| Ports / Configuration |
2 ports (1 × 2 matrix) |
| Max Data Rate |
28 Gb/s |
| Temperature Range |
–40 °C to +85 °C (–40 °F to +185 °F) |
| Sealable |
No |
| Contact Termination |
Through-hole, press-fit, tail length 2.05 mm |
| PCB Thickness (recommended) |
1.57 mm (0.062 in) |
| Cage Material |
Nickel Silver |
| Heat Sink |
Pin type, anodized black finish |
| Heat Sink Height |
4.2 mm |
| EMI Features |
Internal & external EMI springs |
| Flammability Rating |
UL 94V-0 |
| Packaging |
Box & Tray |
| Included Accessories |
Lightpipe |
Applications of 4-2170808-1 Cage Assembly With Heat Sink
This cage assembly is intended for high-speed data transmission applications using QSFP28 / QSFP56 optical or copper modules. It is suitable for:
- Data center switch/router ports
- High-speed transceivers in telecom/networking equipment
- Backplane / board-to-board interconnects
- Systems requiring robust thermal and EMI control under wide ambient temperature conditions