LINK-PP INT'L TECHNOLOGY CO., LIMITED
LINK-PP INT'L TECHNOLOGY CO., LIMITED
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| Profile Feature | Pb-Free Assembly | Sn-Pb Assembly |
|---|---|---|
| Preheat Temperature Min | 100 °C | 100 °C |
| Preheat Temperature Typical | 120 °C | 120 °C |
| Preheat Temperature Max | 130 °C | 130 °C |
| Preheat Time ts from Ts min to Ts max | 70 seconds | 70 seconds |
| Ramp-up Rate | 150 °C max | 150 °C max |
| Peak Temperature | 250 °C - 260 °C | 235 °C - 260 °C |
| Time of actual peak temperature | max. 10 seconds max. 5 seconds each wave | max. 10 seconds max. 5 seconds each wave |
| Ramp-down Rate, Min | ~ 2 K/ second | ~ 2 K/ second |
| Ramp-down Rate, Typical | ~ 3.5 K/ second | ~ 3.5 K/ second |
| Ramp-down Rate, Max | ~ 5 K/ second | ~ 5 K/ second |
| Time 25 °C to 25 °C | 4 minutes | 4 minutes |
74991114412 Datasheet:
Through-Hole Reflow Soldering (THR) in RJ45 Connector Assembly:
Through-hole reflow soldering (THR) is a widely used process in modern circuit board manufacturing, especially for components that require high mechanical strength, such as RJ45 connectors. THR technology provides several advantages by inserting components into through-holes of PCB boards and fixing them using a reflow soldering process, making it increasingly popular in electronic manufacturing. Features of through-hole reflow soldering: Through-hole insertion can achieve tighter circuit connections, achieve higher density assembly, can reduce interference between lines, and have relatively low manufacturing costs.
During the assembly process of RJ45 connectors, through holes are designed to connect the pins of the connector to ensure the firmness of the connection. The specific steps include: