LINK-PP INT'L TECHNOLOGY CO., LIMITED
LINK-PP INT'L TECHNOLOGY CO., LIMITED
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| 2X1 Port 8P8C RJ45 Magjack with 5G Base-T Integrate Magnetics ,Without LED,Tab Up/Down,RoHS | |
| LINK-PP Part Number | LPJxxxxNL |
| Abracon LLC Part Number | ARJM21A1-811-NN-EW2 |
| Application-Lan | ETHERNET(NoN PoE) |
| AutomDX | YES |
| Bst Circuit | YES |
| Configuration RX | T,C |
| Configuration TX | T,C |
| Contact Mating Area Plating | GOLD 6u"/15u"/30u" |
| Cores per Port | 8 |
| Diodes | NO DIODES |
| LED Option | without LEDS |
| Latch | TAB UP/TAB DOWN |
| Number of Ports | 2X1 |
| PCB | FR4 |
| PCB Mount Angle | SIDE ENTRY |
| PCB Retaining Post | T POST |
| Package Height (Inches) | 1.003 |
| Package Height (mm) | 25.50 |
| Package Length (Inches) | 1.108 |
| Package Length (mm) | 28.14 |
| Package Width (Inches) | 0.676 |
| Package Width (mm) | 17.17 |
| Pin Type | THT SOLDER |
| RoHS Compliant | YES-RoHS-5 WITH LEAD IN SOLDER EXEMPTION |
| Search | YES |
| Shield EMI Tabs | WITH |
| Speed | 5G Base-T |
| Temperature | -40°C ~ 85°C |
| Turns Ratio RX | 1CT:1CT |
| Turns Ratio TX | 1CT:1CT |
NOTES:
1.Designed to support application,such as SOHO(ADSL
modems),LAN-on-Motherboard(LOM),hub and Switches.
2.Meets IEEE 802.3 specification
3.Connector Materials:
Housing:Thermoplastic UL94V-0
Contact/Shield: Copper alloy
Shield plating: Nickel
Contact plating: Gold 6 micro-inches min.In contact
area.
4.Wave solder tip temperature: 265℃ Max
Wave solder tip temperature time: 5 Sec Max
Applications For Terminal User
Used for networking and communication equipments such as HUB, PC card, Switch, Router, PC Mainboard, SDH, PDH, IP Phone, xDSL modem,Call Center solutions , Complex set top boxes , VOIP gateways setup,Border Gateway Protocol,fast ethernet switch ...
Competitive Advantage
18 years production experience,
2600 staff,
100% test
Flexible delivery time
Main Customer
Design for Ti , Intel , Samsung , Fluke , Jabil , Flextronics ,Cypress, Freescale,EKF.......
EMS Application
Flexible PCB Assembly; Rigid-Flexible PCB Assembly; Microelectronic, Flip Chip; Microelectronic, Chip On Board; Optoelectronic Assembly; RF / Wireless Assembly; Through Hole Assembly; Surface Mount Assembly; System Assembly; Printed Circuit Board Assembly