XFATM9-CALxu1-4S RJ45 Modular Jack With 10/100 Integrated Magnetics LPJ0012ABNL
Emitting Color | λp(nm) | VF@IF=20mA | IR @VR=5V |
Green | 565 | 1.8~2.6V | 10μA max |
Yellow | 585 | 1.8~2.6V | 10μA max |
NOTES:
- Designed to support application,such as SOHO(ADSLmodems),LAN-on- Motherboard(LOM),hub and Switches.
- Meets IEEE 802.3 specification
- Connector Materials:
- Housing: Thermoplastic PBT+30%G.F UL94V-0
- Contact: Phosphor Bonze C5210R-EH Thickness=0.35mm
- Pins: Brass C2680R-H Thickness=0.35mm
- Shield: SUS 201-1/2H Thickness=0.2mm
- Contact plating: Gold 6 micro-inches min.In contact area.
- Wave solder tip temperature: 265℃ Max, 5 Sec Max
- UL Certification: File Number E484635
LINK-PP Part Number | LPJ0012ABNL |
Designing Model | XFATM9-CALxu1-4S = XFATM9-CALGY1-4S |
Cores per Port | 4 |
LED Option | GREEN/YELLOW |
Latch | TAB DOWN |
Number of Ports | 1X1 |
PCB Mount Angle | SIDE ENTRY |
Package Height (mm) | 13.40 |
Package Length (mm) | 21.30 |
Package Width (mm) | 15.90 |
Shield EMI Tabs | WITH |
Speed | 10/100 BASE-T |
Temperature | 0 TO 70℃ |
Turns Ratio RX | 1CT:1CT |
Turns Ratio TX | 1CT:1CT |
Applications :
Fibre Channel Products
Touch Screen Sensors
Defense and Security
Surface Mount Assembly
Main Customer
Design for Ti , Intel , Samsung , Fluke , Jabil , Flextronics ,Cypress, Freescale,EKF.......
EMS Application
Built-in Flexible PCB Assembly; Rigid-Flexible PCB Assembly; Microelectronic, Flip Chip; Microelectronic, Chip On Board; Optoelectronic Assembly; RF / Wireless Assembly; Through Hole Assembly; Surface Mount Assembly; System Assembly; Printed Circuit Board Assembly
XFATM9-CALxu1-4S RJ45 Modular Jack With 10/100 Integrated Magnetics LPJ0012ABNL