LINK-PP INT'L TECHNOLOGY CO., LIMITED

LINK-PP INT'L TECHNOLOGY CO., LIMITED

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HFJV1-1G16-L11RL Vertical RJ45 Jack Top Entry MSP430F5239IRGCT Microcontroller

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City:huizhou
Province/State:guangdong
Country/Region:china
Contact Person:LINK-PP Global
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HFJV1-1G16-L11RL Vertical RJ45 Jack Top Entry MSP430F5239IRGCT Microcontroller

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Brand Name :LINK-PP
Model Number :HFJV1-1G16-L11RL
Certification :UL,ROHS,Reach,ISO
Place of Origin :GuangDong, China
MOQ :50/500/1000/25K
Price :$0.09-$1.85
Payment Terms :TT,NET30/60/90 Days
Supply Ability :3000000/Month
Delivery Time :Stock
Packaging Details :60 pcs in 1 tray,20tray in 1 carton, which is 37*30*30 cm, 11KGS (1200 pcs) of each carton
part Number :HFJV1-1G16-L11RL
Mass Production :LPJD0773BFNL
Original Munafactuer :LINK-PP
Application :10/100/1000 Base-T
Termination :Solder
LEDs :Optional
IC Match :C8051F349-GQ
Type :DIP / Top Entry
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HFJV1-1G16-L11RL Vertical RJ45 Jack Top Entry MSP430F5239IRGCT Microcontroller

Quick Details

1.RJ45 1X1 Vertical
2.Through Hole
3.10/100/1000 Base-T
4.Contact Area : Gold Flash

MAG., REVERSE LATCH , LED optional, EMI-finger Optional.

5.Designing Model: 【HFJV1-1G16-L11RL】

6.Mass Production Model:【LPJD0773BFNL】


Description

Vertical Ethernet RJ45 Jack with 1000 Base-T Integrated Magnetics,Green/Green LED,RoHS
LINK-PP Part NumberLPJD0773BFNL
Halo Part NumberHFJV1-1G16-L11RL
Application-LanETHERNET(NoN PoE)
AutomDXYES
Bst CircuitYES
Configuration RXT,C
Configuration TXT,C
Contact Mating Area PlatingGOLD 6u"/15u"/30u"
Cores per Port4
DiodesNO DIODES
LED OptionGREEN/GREEN
LatchTAB UP
Number of Ports1X1
PCBFR4
PCB Mount AngleSIDE ENTRY
PCB Retaining PostT POST
Package Height (Inches) 0.650
Package Height (mm) 16.51
Package Length (Inches) 0.849
Package Length (mm) 21.56
Package Width (Inches) 0.628
Package Width (mm) 15.95
Pin TypeTHT SOLDER
RoHS CompliantYES-RoHS-5 WITH LEAD IN SOLDER EXEMPTION
SearchYES
Shield EMI TabsWITHOUT
Speed1000 BASE-T
Temperature0 TO 70℃
Turns Ratio RX 1CT:1CT
Turns Ratio TX 1CT:1CT

1X1-Rj45 Vertical With Magnetics with/without leds, meeting IEEE 802.3 af/at

1. Product Type Features:

1) Product Type = Connector
2) Jack Type = RJ45
3) Profile = Standard
4) PCB Mounting Orientation = Side Entry (Right Angle)/Top Entry(Vertical)

2. Mechanical Attachment:
1) Jack Configuration = 1 x 1

3. Electrical Characteristics:
1) Shielded = Yes

4. Termination Related Features:
1) EMI Finger - Bottom = Without
2) Termination Method = Solder

5. Body Related Features:
1) Port Configuration = Single/Multi
2) EMI Fingers -Top and Sides = With/ Without
3) Latch Orientation = Standard - Latch Down
4) PCB Tail Length

6. Contact Related Features:
1) Preloaded = Yes
2) Contact Termination Type = Through Hole/Surface Mount

7. Housing Related Features:
1) Connector Style = Jack

8. Industry Standards:
1) RoHS/ELV Compliance = RoHS compliant, ELV compliant
2) Lead Free Solder Processes = Wave solder capable to 240°C,

Wave solder capable to 260°C, Wave solder capable to 265°C

Reflow-Soldering Optional;
3) RoHS/ELV Compliance History = Always was RoHS compliant

9. Identification Marking:
1) Left LED Color (Position #1) = Green - 250 ohm resistor
2) Right LED Color (Position #2) = Green - 250 ohm resistor

10. Conditions for Usage:
1) Applies To = Printed Circuit Board
2) Environmental Conditions = Office / Premises
3) Operating Temperature (°C ) = 0 - 70/-40 - +85

11.Hipot:

1500Vrms MIN

HFJV1-1G16-L11RL Vertical RJ45 Jack Top Entry MSP430F5239IRGCT Microcontroller

Applications For Terminal User

Used for networking and communication equipments such as HUB, PC card, Switch, Router, PC Mainboard, SDH, PDH, IP Phone, xDSL modem,Call Center solutions , Complex set top boxes , VOIP gateways setup,Border Gateway Protocol,fast ethernet switch ...

Competitive Advantage

18 years production experience,

2600 staff,

100% test

Flexible delivery time

Main Customer


Design for Ti , Intel , Samsung , Fluke , Jabil , Flextronics ,Cypress, Freescale,EKF.......

EMS Application


Built-in Flexible PCB Assembly; Rigid-Flexible PCB Assembly; Microelectronic, Flip Chip; Microelectronic, Chip On Board; Optoelectronic Assembly; RF / Wireless Assembly; Through Hole Assembly; Surface Mount Assembly; System Assembly; Printed Circuit Board Assembly


































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